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BSM300C12P3E201

MOSFET Modules 1200V, 300A, Boost Chopper, Full SiC-Power Module with Trench MOSFET
Technical Specifications
FET Type N-Channel
Technology SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss) 1200 V
Current - Continuous Drain (Id) @ 25°C 300A (Tc)
Vgs(th) (Max) @ Id 5.6V @ 80mA
Vgs (Max) +22V, -4V
Input Capacitance (Ciss) (Max) @ Vds 15000 pF @ 10 V
Power Dissipation (Max) 1360W (Tc)
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Chassis Mount
Supplier Device Package Module
Package / Case Module
Product Attributes
Packaging Bulk
Standard Pack Qty4
Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
14,282
In Stock
Packaging: Bulk
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✔ Global Shipping
✔ Genuine Parts
Test Report Available Upon Request click here to view sample report
Key Specifications
CategoryMOSFET Modules
RoHSRoHS Compliant By Exemption
Lifecycle
Reported Lead Time 189 Days (from factory)
Documentation
Not Available
Compliance & Export Information
Country Code
CNHTS 8504409190
USHTS 8541590080
ECCN EAR99
Product Overview

BSM300C12P3E201 by ROHM Semiconductor is a mosfet modules designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Discrete semiconductor products include individual transistors, diodes, and thyristors, as well as small arrays of such composed of two, three, four, or some other small number of similar devices within a single package. They are most commonly used for constructing circuits with considerable voltage or current stress, or for realizing very basic circuit functions.

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