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DF17MR12W1M1HFB86BPSA1

Discrete Semiconductor Modules EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
Technical Specifications
Technology Silicon Carbide (SiC)
Configuration 3 N-Channel
FET Feature -
Drain to Source Voltage (Vdss) 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C 50A (Tj)
Rds On (Max) @ Id, Vgs 24mOhm @ 50A, 18V
Vgs(th) (Max) @ Id 5.15V @ 20mA
Gate Charge (Qg) (Max) @ Vgs 74nC @ 18V
Input Capacitance (Ciss) (Max) @ Vds 4400pF @ 800V
Power - Max -
Operating Temperature -40°C ~ 175°C (TJ)
Grade -
Qualification -
Mounting Type Chassis Mount
Package / Case Module
Supplier Device Package -
Product Attributes
Packaging Tray
Standard Pack Qty24
Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
5,119
In Stock
Packaging: Tray
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✔ 24h Response
✔ Global Shipping
✔ Genuine Parts
Test Report Available Upon Request click here to view sample report
Key Specifications
CategoryDiscrete Semiconductor Modules
RoHSRoHS Compliant
LifecycleNew Product
Reported Lead Time 16 Days (from factory)
Documentation
Download Datasheet
Compliance & Export Information
Country Code
CAHTS 8541210000
USHTS 8541210095
JPHTS 854121000
TARIC 8541210000
MXHTS 8541210100
ECCN EAR99
Product Overview

DF17MR12W1M1HFB86BPSA1 by Infineon Technologies is a discrete semiconductor modules designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Discrete semiconductor products include individual transistors, diodes, and thyristors, as well as small arrays of such composed of two, three, four, or some other small number of similar devices within a single package. They are most commonly used for constructing circuits with considerable voltage or current stress, or for realizing very basic circuit functions.

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