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FS03MR12A6MA1BBPSA1 Infineon Technologies
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FS03MR12A6MA1BBPSA1

Discrete Semiconductor Modules HYBRID PACK DRIVE G1 SIC
Technical Specifications
Technology Silicon Carbide (SiC)
Configuration 6 N-Channel (3-Phase Bridge)
Drain to Source Voltage (Vdss) 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C 400A (Tj)
Rds On (Max) @ Id, Vgs 3.7mOhm @ 400A, 15V
Vgs(th) (Max) @ Id 5.55V @ 240mA
Gate Charge (Qg) (Max) @ Vgs 1320nC @ 15V
Input Capacitance (Ciss) (Max) @ Vds 42500pF @ 600V
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Chassis Mount
Package / Case Module
Supplier Device Package AG-HYBRIDD-2
📦 Product Attributes
Packaging Tray
Standard Pack Qty 6
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
4,014
Units In Stock
📦 Tray
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🔑 Key Specifications
Category Discrete Semiconductor Modules
RoHS
Lifecycle Not Recommended for New Designs
Lead Time 273 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
CNHTS 8504409100
USHTS 8541290065
ECCN EAR99
Product Overview

The FS03MR12A6MA1BBPSA1 from Infineon Technologies falls under the discrete semiconductor modules category. It features a technology of Silicon Carbide (SiC), a configuration of 6 N-Channel (3-Phase Bridge), a drain to source voltage of 1200V (1.2kV), a current, continuous drain (id) @ 25°C of 400A (Tj), a rds on (max) @ id, vgs of 3.7mOhm @ 400A, 15V and a vgs(th) (max) @ id of 5.55V @ 240mA. This part has a typical lead time of 273 Days from factory and ships with a full manufacturer datasheet available for download. You can source FS03MR12A6MA1BBPSA1 through Simplytronix, with fast shipping and verified authenticity.

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