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FS1150R08A8P3CHPSA1 Infineon Technologies
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FS1150R08A8P3CHPSA1

Discrete Semiconductor Modules HybridPACK Drive G2 module
Technical Specifications
IGBT Type -
Configuration Three Phase Inverter
Voltage - Collector Emitter Breakdown (Max) 750 V
Current - Collector (Ic) (Max) 600 A
Power - Max 1000 W
Vce(on) (Max) @ Vge, Ic 1.21V @ 15V, 600A
Current - Collector Cutoff (Max) 1 mA
Input Capacitance (Cies) @ Vce 60800 pF @ 50 V
Input Standard
NTC Thermistor No
Operating Temperature -40°C ~ 175°C (TJ)
Mounting Type Chassis Mount
Package / Case Module
Supplier Device Package AG-HDG2XT-7611
📦 Product Attributes
Packaging Tray
Standard Pack Qty 6
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
13,299
Units In Stock
📦 Tray
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🔑 Key Specifications
Category Discrete Semiconductor Modules
RoHS RoHS Compliant
Lifecycle New Product
Lead Time 182 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
CAHTS 8541290000
USHTS 8541290065
JPHTS 854129000
TARIC 8541290000
MXHTS 8541299900
ECCN EAR99
Product Overview

Infineon Technologies's FS1150R08A8P3CHPSA1 is a widely used discrete semiconductor modules in electronic designs. Notable characteristics of this part include a IGBT type of -, a configuration of Three Phase Inverter, a voltage, collector emitter breakdown of 750 V, a current, collector (ic) of 600 A, a power, max of 1000 W and a vce(on) (max) @ vge, ic of 1.21V @ 15V, 600A. This part has a typical lead time of 182 Days from factory and ships with a full manufacturer datasheet available for download. You can source FS1150R08A8P3CHPSA1 through Simplytronix, with fast shipping and verified authenticity.

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