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FF8MR12W1M1HB11BPSA1 Infineon Technologies
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FF8MR12W1M1HB11BPSA1

Discrete Semiconductor Modules CoolSiC MOSFET half-bridge module 1200 V
Technical Specifications
Technology Silicon Carbide (SiC)
Configuration -
FET Feature -
Drain to Source Voltage (Vdss) 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C -
Rds On (Max) @ Id, Vgs -
Vgs(th) (Max) @ Id -
Gate Charge (Qg) (Max) @ Vgs -
Input Capacitance (Ciss) (Max) @ Vds -
Power - Max -
Operating Temperature -
Mounting Type Chassis Mount
Package / Case Module
Supplier Device Package AG-EASY1B
📦 Product Attributes
Packaging Tray
Standard Pack Qty 24
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
8,086
Units In Stock
📦 Tray
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🔑 Key Specifications
Category Discrete Semiconductor Modules
RoHS RoHS Compliant
Lifecycle
Lead Time 140 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
CNHTS 8504409100
CAHTS 8541210000
USHTS 8541210095
JPHTS 854121000
TARIC 8541210000
MXHTS 8541210100
ECCN EAR99
Product Overview

Manufactured by Infineon Technologies, the FF8MR12W1M1HB11BPSA1 is classified as a discrete semiconductor modules. It features a technology of Silicon Carbide (SiC), a configuration of -, a FET feature of -, a drain to source voltage of 1200V (1.2kV), a current, continuous drain (id) @ 25°C of - and a rds on (max) @ id, vgs of -. This part has a typical lead time of 140 Days from factory and ships with a full manufacturer datasheet available for download. You can source FF8MR12W1M1HB11BPSA1 through Simplytronix, with fast shipping and verified authenticity.

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