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FF4MR12W2M1HPB11ABPSA1 Infineon Technologies
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FF4MR12W2M1HPB11ABPSA1

MOSFET Modules EasyDUAL module with CoolSiC Trench MOSFET and PressFIT / NTC / TIM
Technical Specifications
Technology Silicon Carbide (SiC)
Configuration 2 N-Channel (Half Bridge)
FET Feature -
Drain to Source Voltage (Vdss) 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C 190A
Rds On (Max) @ Id, Vgs 6mOhm @ 200A, 18V
Vgs(th) (Max) @ Id 5.15V @ 80mA
Gate Charge (Qg) (Max) @ Vgs 594nC @ 18V
Input Capacitance (Ciss) (Max) @ Vds 17600pF @ 800V
Power - Max 20mW
Operating Temperature -40°C ~ 175°C (TJ)
Grade -
Qualification -
Mounting Type Chassis Mount
Package / Case Module
Supplier Device Package AG-EASY2B
📦 Product Attributes
Packaging Tray
Standard Pack Qty 18
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
8,398
Units In Stock
📦 Tray
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🔑 Key Specifications
Category MOSFET Modules
RoHS RoHS Compliant
Lifecycle New Product
Lead Time 203 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
CAHTS 8541210000
USHTS 8541210095
JPHTS 854121000
TARIC 8541210000
MXHTS 8541210100
ECCN EAR99
Product Overview

Infineon Technologies's FF4MR12W2M1HPB11ABPSA1 is a widely used mosfet modules in electronic designs. Notable characteristics of this part include a technology of Silicon Carbide (SiC), a configuration of 2 N-Channel (Half Bridge), a FET feature of -, a drain to source voltage of 1200V (1.2kV), a current, continuous drain (id) @ 25°C of 190A and a rds on (max) @ id, vgs of 6mOhm @ 200A, 18V. This part has a typical lead time of 203 Days from factory and ships with a full manufacturer datasheet available for download. You can source FF4MR12W2M1HPB11ABPSA1 through Simplytronix, with fast shipping and verified authenticity.

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