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W66BQ6NBUAFJ Winbond
*For representation only.

W66BQ6NBUAFJ

DRAM 2Gb LPDDR4X, x16, 1600MHz, -40C 105C
Technical Specifications
Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR4X
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface LVSTL_11
Clock Frequency 1.6 GHz
Write Cycle Time - Word, Page 18ns
Access Time 3.5 ns
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
📦 Product Attributes
Packaging Tray
Standard Pack Qty 144
🔁 Alternate / Replacement Parts
Alternate Packaging W66BQ6NBUAFJ TR
Suggested Replacement
5,949
Units In Stock
📦 Tray
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🔑 Key Specifications
Category DRAM
RoHS RoHS Compliant
Lifecycle Verify Status with Factory
Lead Time 365 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
CNHTS 8542329010
CAHTS 8542320020
USHTS 8542320036
MXHTS 8542320299
ECCN EAR99
Product Overview

The W66BQ6NBUAFJ from Winbond falls under the dram category. It features a programmable of Not Verified, a memory type of Volatile, a memory format of DRAM, a technology of SDRAM - Mobile LPDDR4X, a memory size of 2Gbit and a memory organization of 128M x 16. This part has a typical lead time of 365 Days from factory and ships with a full manufacturer datasheet available for download. Simplytronix stocks W66BQ6NBUAFJ for same-day shipping with genuine parts guaranteed.

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