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STM32WBA55CEU7

RF System on a Chip - SoC Wireless Arm Cortex-M33 TrustZone MCU 100MHz 512Kbytes Flash BLE 5.4 802 ZigBee
Technical Specifications
Type TxRx + MCU
RF Family/Standard 802.15.4, Bluetooth
Protocol Bluetooth v5.4
Modulation GFSK
Data Rate (Max) 2Mbps
Power - Output 10dBm
Sensitivity -102dBm
Memory Size 512kB Flash, 96kB SRAM
Serial Interfaces ADC, GPIO, I2C, IrDA, SPI, UART, USART
GPIO 31
Voltage - Supply 1.71V ~ 3.6V
Current - Receiving 4.41mA ~ 10.2mA
Current - Transmitting 5.24mA ~ 25.3mA
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 48-UFQFN Exposed Pad
Supplier Device Package 48-UFQFPN (7x7)
Product Attributes
Packaging Tray
Standard Pack Qty1560
Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
10,390
In Stock
Packaging: Tray
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✔ 24h Response
✔ Global Shipping
✔ Genuine Parts
Test Report Available Upon Request click here to view sample report
Key Specifications
CategoryRF System on a Chip - SoC
RoHSRoHS Compliant
LifecycleNew Product
Reported Lead Time 140 Days (from factory)
Documentation
Not Available
Compliance & Export Information
Country Code
CNHTS 8542319092
CAHTS 8542310000
USHTS 8542310025
ECCN 5A992.C
Product Overview

STM32WBA55CEU7 by STMicroelectronics is a rf system on a chip - soc designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Radio Frequency and Intermediate Frequency (RF/IF) products are used for wireless transmission of information by means of electromagnetic radiation. Radio Frequency Identification (RFID) is a specific subset of general RF applications, characterized by use of small, inexpensive devices known as "tags" capable of containing a limited amount of information, that can be wirelessly retrieved (and in some cases modified) through the use of a specialized device known as a "reader" and which are commonly used for object or material tracking, inventory, and similar purposes. Products found within this category may range from finished products for end use, to component-level products and materials from which such finished goods are assembled.

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