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DA14531-00000FX2

RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOsin FCGQFN24 and 0.4mm ball pitch package
Technical Specifications
Programmable Not Verified
Type TxRx + MCU
RF Family/Standard Bluetooth
Protocol Bluetooth v5.1
Modulation -
Frequency 2.4GHz
Data Rate (Max) -
Power - Output 2.5dBm
Sensitivity -94dBm
Memory Size 48kB RAM, 144kB ROM
Serial Interfaces ADC, GPIO, I2C, SPI, UART
GPIO 12
Voltage - Supply 1.1V ~ 3.3V
Current - Receiving 2.2mA
Current - Transmitting 3.5mA
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 24-WFQFN, FC
Supplier Device Package 24-FCGQFN (2.2x3)
Product Attributes
Packaging Reel
Standard Pack Qty4000
Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
8,537
In Stock
Packaging: Reel
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✔ 24h Response
✔ Global Shipping
✔ Genuine Parts
Test Report Available Upon Request click here to view sample report
Key Specifications
CategoryRF System on a Chip - SoC
RoHSRoHS Compliant
Lifecycle
Reported Lead Time 126 Days (from factory)
Documentation
Download Datasheet
Compliance & Export Information
Country Code
CNHTS 8542399000
CAHTS 8542310000
USHTS 8542310070
ECCN EAR99
Product Overview

DA14531-00000FX2 by Renesas / Dialog is a rf system on a chip - soc designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Radio Frequency and Intermediate Frequency (RF/IF) products are used for wireless transmission of information by means of electromagnetic radiation. Radio Frequency Identification (RFID) is a specific subset of general RF applications, characterized by use of small, inexpensive devices known as "tags" capable of containing a limited amount of information, that can be wirelessly retrieved (and in some cases modified) through the use of a specialized device known as a "reader" and which are commonly used for object or material tracking, inventory, and similar purposes. Products found within this category may range from finished products for end use, to component-level products and materials from which such finished goods are assembled.

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