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BM70BLES1FC2-0B05BA

Bluetooth Modules - 802.15.1 Bluetooth BLE Module, Shielded, Antenna, 12x22mm, Industrial Temp
Technical Specifications
Programmable Not Verified
RF Family/Standard Bluetooth
Protocol Bluetooth v5.0
Modulation -
Frequency 2.402GHz ~ 2.48GHz
Data Rate -
Power - Output 0dBm
Sensitivity -90dBm
Serial Interfaces ADC, GPIO, I2C, PWM, SPI, UART
Antenna Type Integrated, Chip
Utilized IC / Part -
Memory Size 256kB Flash, 32kB ROM, 24kB SRAM
Voltage - Supply 1.9V ~ 3.6V
Current - Receiving 10mA
Current - Transmitting 10mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 33-SMD Module
Product Attributes
Packaging Tray
Standard Pack Qty88
Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
8,789
In Stock
Packaging: Tray
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✔ 24h Response
✔ Global Shipping
✔ Genuine Parts
Test Report Available Upon Request click here to view sample report
Key Specifications
CategoryBluetooth Modules - 802.15.1
RoHSRoHS Compliant
Lifecycle
Reported Lead Time 84 Days (from factory)
Documentation
Download Datasheet
Compliance & Export Information
Country Code
CNHTS 8517629990
USHTS 8517790000
ECCN 5A992.C
Product Overview

BM70BLES1FC2-0B05BA by Microchip Technology is a bluetooth modules - 802.15.1 designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Radio Frequency and Intermediate Frequency (RF/IF) products are used for wireless transmission of information by means of electromagnetic radiation. Radio Frequency Identification (RFID) is a specific subset of general RF applications, characterized by use of small, inexpensive devices known as "tags" capable of containing a limited amount of information, that can be wirelessly retrieved (and in some cases modified) through the use of a specialized device known as a "reader" and which are commonly used for object or material tracking, inventory, and similar purposes. Products found within this category may range from finished products for end use, to component-level products and materials from which such finished goods are assembled.

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