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ESP32-D0WD-V3

RF System on a Chip - SoC SMD IC WiFi Dual Core BT Combo
Technical Specifications
Programmable Not Verified
Type TxRx + MCU
RF Family/Standard Bluetooth, WiFi
Protocol 802.11b/g/n, Bluetooth 4.2
Modulation 8DPSK, DSSS, DQPSK, OFDM
Frequency 2.412GHz ~ 2.484GHz
Data Rate (Max) 150Mbps
Power - Output 20.5dBm
Sensitivity -97dBm
Memory Size 448kB ROM, 520kB SRAM
Serial Interfaces ADC, I2C, I2S, SDIO, SPI, PWM, UART
GPIO 34
Voltage - Supply 2.3V ~ 3.6V
Current - Receiving 95mA ~ 100mA
Current - Transmitting 130mA ~ 240mA
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 48-VFQFN Exposed Pad
Supplier Device Package 48-QFN (5x5)
Product Attributes
Packaging Reel
Standard Pack Qty5000
Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
11,506
In Stock
Packaging: Reel
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✔ 24h Response
✔ Global Shipping
✔ Genuine Parts
Test Report Available Upon Request click here to view sample report
Key Specifications
CategoryRF System on a Chip - SoC
RoHSRoHS Compliant
Lifecycle
Reported Lead Time 173 Days (from factory)
Documentation
Download Datasheet
Compliance & Export Information
Country Code
CNHTS 8542319092
CAHTS 8542310000
USHTS 8542310070
ECCN 5A992.C
Product Overview

ESP32-D0WD-V3 by Espressif Systems is a rf system on a chip - soc designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Radio Frequency and Intermediate Frequency (RF/IF) products are used for wireless transmission of information by means of electromagnetic radiation. Radio Frequency Identification (RFID) is a specific subset of general RF applications, characterized by use of small, inexpensive devices known as "tags" capable of containing a limited amount of information, that can be wirelessly retrieved (and in some cases modified) through the use of a specialized device known as a "reader" and which are commonly used for object or material tracking, inventory, and similar purposes. Products found within this category may range from finished products for end use, to component-level products and materials from which such finished goods are assembled.

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