*For representation only.
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Technical Specifications
| Proto Board Type | SMD to DIP |
| Package Accepted | BGA |
| Number of Positions | 25 |
| Pitch | 0.020" (0.50mm) |
| Board Thickness | 0.062" (1.57mm) 1/16" |
| Material | FR4 Epoxy Glass |
| Size / Dimension | 0.700" x 1.300" (17.78mm x 33.02mm) |
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Product Attributes
| Packaging | |
| Standard Pack Qty | 1 |
1,326
Units In Stock
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- 24-hour response
- Global shipping
- Genuine parts guaranteed
Test report available upon request —
view sample report
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Key Specifications
| Category | Sockets & Adapters |
| RoHS | RoHS Compliant |
| Lifecycle | |
| Lead Time | 0 Days (from factory) |
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Documentation
⬇ Download Datasheet
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Compliance & Export
| Country / Standard | Code |
|---|---|
| USHTS | 7218100000 |
| ECCN | EAR99 |
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Product Overview
The BGA0011 from Chip Quik falls under the sockets & adapters category. This component is defined by a proto board type of SMD to DIP, a package accepted of BGA, a number of positions of 25, a pitch of 0.020" (0.50mm), a board thickness of 0.062" (1.57mm) 1/16" and a material of FR4 Epoxy Glass. This part has a typical lead time of 0 Days from factory and ships with a full manufacturer datasheet available for download. Simplytronix carries BGA0011 in stock, backed by a genuine parts guarantee and quick dispatch.
