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XCVC1702-2MLINSVG1369

SoC FPGA XCVC1702-2MLINSVG1369
Technical Specifications
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 110°C (TJ)
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)
📦 Product Attributes
Packaging
Standard Pack Qty 24
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
10,482
Units In Stock
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🔑 Key Specifications
Category SoC FPGA
RoHS RoHS Compliant
Lifecycle
Lead Time 154 Days (from factory)
📄 Documentation
Datasheet not available
🌐 Compliance & Export
Country / Standard Code
USHTS 8542310070
Product Overview

Manufactured by AMD / Xilinx, the XCVC1702-2MLINSVG1369 is classified as a soc fpga. Key specifications include a architecture of MPU, FPGA, a core processor of Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™, a flash size of -, a RAM size of 256KB, a peripherals of DDR, DMA, PCIe and a connectivity of CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG. This part has a typical lead time of 154 Days from factory. Simplytronix stocks XCVC1702-2MLINSVG1369 for same-day shipping with genuine parts guaranteed.

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