I/O Controllers ADi-SIOG-FPGA/12V-2MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 8MB SRAM- 32x DIO

I/O Controllers ADi-SIOG-FPGA/12V-2MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 8MB SRAM- 32x DIO

Single Board Computers 1-slot 4HP 3U CompactPCI blade Intel Xeon E-2276ML processor 32GB DDR4-2666 ECC

Single Board Computers 1-slot 4HP 3U CompactPCI blade Intel Xeon E-2276ML processor 32GB DDR4-2666 ECC

Multiprotocol Modules 802.11a/b/g/n/ac, Wave 2, 2x2, Bluetooth 5, PCIe, USB, M.2 2230Operating Temperature -40-85Intel,9260.NGWGII.NV

Multiprotocol Modules 802.11a/b/g/n/ac, Wave 2, 2x2, Bluetooth 5, PCIe, USB, M.2 2230Operating Temperature -40-85Intel,9260.NGWGII.NV

Interface Modules LP H/P IEEE488 GPIB INTERFACE CRD PCI

Memory Modules DDR5-4800, 32GB, 2Rx8 2Gx8, SO-DIMM 262P, 1.1V, Rank:2, CL40, OP Temp:0 95, Fix Die:No, Samsung Chip(2Gx8),

Memory Modules DDR5-4800, 32GB, 2Rx8 2Gx8, SO-DIMM 262P, 1.1V, Rank:2, CL40, OP Temp:0 95, Fix Die:No, Samsung Chip(2Gx8),

Power Supplies - Chassis Mount Dimension: 205x100x40.5mm, Input Voltage: 100 240Vac, Output Voltage: 3.3V/5V/12V/5Vsb/-5V/-12V, Frequency: 50 60Hz, Efficiency: 65%(Typ)

Power Supplies - Chassis Mount Dimension: 205x100x40.5mm, Input Voltage: 100 240Vac, Output Voltage: 3.3V/5V/12V/5Vsb/-5V/-12V, Frequency: 50 60Hz, Efficiency: 65%(Typ)

DC Power Cords Wire:UL1185, 18AWG, L=300+/-20mm;P1/P2:ET1.0-8(Red)(Cord-end Terminal), P3:DC Plug, oe5.5x2.5

DC Power Cords Wire:UL1185, 18AWG, L=300+/-20mm;P1/P2:ET1.0-8(Red)(Cord-end Terminal), P3:DC Plug, oe5.5x2.5

Memory Modules DDR5-5600, 32GB, 4Gx64, SO-DIMM 262P, 1.1V, CL46, Rank:2, Non-ECC, OP Temp:-0-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Memory Modules DDR5-5600, 32GB, 4Gx64, SO-DIMM 262P, 1.1V, CL46, Rank:2, Non-ECC, OP Temp:-0-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Computer-On-Modules - COM LEC-AL-N3350-4G-64G-CT SMARC Short Size Module with Intel Celeron? N3350, dual core, 4 GB DDR3L, 64GB eMMC, 0 C to 60 C

Computer-On-Modules - COM LEC-AL-N3350-4G-64G-CT SMARC Short Size Module with Intel Celeron? N3350, dual core, 4 GB DDR3L, 64GB eMMC, 0 C to 60 C

I/O Controllers 24V PWR_IN- SA metal cover- ARM Cortex-M4F TM4C1299KCZAD- PIC18F46J11 Logging Processor- 1MB SRAM- 32x DIO- 8x HW Meter & 1x SEC Meter- 4x COM Port- 1x MDB CONN- 2x Feature CONN

I/O Controllers 24V PWR_IN- SA metal cover- ARM Cortex-M4F TM4C1299KCZAD- PIC18F46J11 Logging Processor- 1MB SRAM- 32x DIO- 8x HW Meter & 1x SEC Meter- 4x COM Port- 1x MDB CONN- 2x Feature CONN

Modules Accessories cPCIS-6400XA/NP/NCD/NFDD6U CPCI 4U High Sub-system5-slot,64-bit,RIO,SATA Swap Rack without PSU,FDD,CDROM

Modules Accessories cPCIS-6400XA/NP/NCD/NFDD6U CPCI 4U High Sub-system5-slot,64-bit,RIO,SATA Swap Rack without PSU,FDD,CDROM

Embedded Box Computers Ampere Altra Q32-17 SOC, 2x 16GB DDR4 DRAM, 2x 128GB M.2 SSD, Tower Chassis with Liquid Cooling 120, 750-watt power supply

Embedded Box Computers Ampere Altra Q32-17 SOC, 2x 16GB DDR4 DRAM, 2x 128GB M.2 SSD, Tower Chassis with Liquid Cooling 120, 750-watt power supply

Camera Accessories Acrylic kit for AI camera kit

Modules Accessories MCS-2040 Chassis, W/T. storage, DH

Computer-On-Modules - COM EGX-MXM-A2000-8G-35W/Adlink logo

Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU , 2 GB LPDDR4, 32 GB eMMC, 0 C to 60 C

Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, NPU , 2 GB LPDDR4, 32 GB eMMC, 0 C to 60 C

Computer-On-Modules - COM LEC-iMX62-2G-8G-ER SMARC Short Size Module with NXP i.MX6, Dual, 2 GB RAM, 8 GB eMMC, -40 C to +85 C

Computer-On-Modules - COM LEC-iMX62-2G-8G-ER SMARC Short Size Module with NXP i.MX6, Dual, 2 GB RAM, 8 GB eMMC, -40 C to +85 C

Development Boards & Kits - x86 COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

Development Boards & Kits - x86 COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

Industrial Box PCs ROScube Pico TGL, Intel Core i5-1145G7E, RQP-T35, DDR4 16G, 128G SSD

Industrial Box PCs ROScube Pico TGL, Intel Core i5-1145G7E, RQP-T35, DDR4 16G, 128G SSD

D-Sub Cables C809MDB-62 to eight DB-9 male cable for C588(P588U card),C888(P888 card).

D-Sub Cables C809MDB-62 to eight DB-9 male cable for C588(P588U card),C888(P888 card).

Memory Cards microSD, SDXC/SDHC, 32GB, C10/UHS-I U1, 100R/70W, 2.7-3.6V, Endurance:3K P/E, MLC, 11x15x1mm, OP Temp:-25-85

Memory Cards microSD, SDXC/SDHC, 32GB, C10/UHS-I U1, 100R/70W, 2.7-3.6V, Endurance:3K P/E, MLC, 11x15x1mm, OP Temp:-25-85

Memory Modules DDR4-2400, 32GB, 4Gx64, SO-DIMM 260P, 1.2V, CL17, Rank:2, Non-ECC, OP Temp:0-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Memory Modules DDR4-2400, 32GB, 4Gx64, SO-DIMM 260P, 1.2V, CL17, Rank:2, Non-ECC, OP Temp:0-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Computer-On-Modules - COM EGX-MXM-AD

Solid State Drives - SSD M.2 2242, NVMe PCIe Gen 3x2 B+M Key256GB, Transcend TS256GMTE452TSupply voltage/Tolerance:3.3V+/-5% Operating Temperature: 0- 70CSequential : Read Up to 1700 MB/s, Write Up to 1250 MB/sForm Factor: 22mm x 42mm x 3.58mm

Solid State Drives - SSD M.2 2242, NVMe PCIe Gen 3x2 B+M Key256GB, Transcend TS256GMTE452TSupply voltage/Tolerance:3.3V+/-5% Operating Temperature: 0- 70CSequential : Read Up to 1700 MB/s, Write Up to 1250 MB/sForm Factor: 22mm x 42mm x 3.58mm

Memory Modules DDR4-2666, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8)

Memory Modules DDR4-2666, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8)