D-Sub Cables C809MDB-62 to eight DB-9 male cable for C588(P588U card),C888(P888 card).

D-Sub Cables C809MDB-62 to eight DB-9 male cable for C588(P588U card),C888(P888 card).

Computer-On-Modules - COM nanoX-BT-E3845-4GMini COM Express Type 10 module with Intel Atom E3845 at 1.91 GHz and 4GB non ECC DDR3L

Computer-On-Modules - COM nanoX-BT-E3845-4GMini COM Express Type 10 module with Intel Atom E3845 at 1.91 GHz and 4GB non ECC DDR3L

I/O Controllers ADi-SIOG-FPGA/12V-2MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 8MB SRAM- 32x DIO

I/O Controllers ADi-SIOG-FPGA/12V-2MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 8MB SRAM- 32x DIO

Industrial Box PCs ROScube-X, w/GMSL2, RQX-58G, Xavier 32G DDR, 32G eMMc, w/o expansion box

Industrial Box PCs ROScube-X, w/GMSL2, RQX-58G, Xavier 32G DDR, 32G eMMc, w/o expansion box

Industrial Computing Accessories Material: SYFW-GAC-2001,Adhesive: W242,Color: Black,Size: 60x60x5.0mm

Industrial Computing Accessories Material: SYFW-GAC-2001,Adhesive: W242,Color: Black,Size: 60x60x5.0mm

Memory Modules DDR4-2400, 16GB, 2Gx72, R-DIMM 288P, 1.2V, Rank:2, CL17, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8)

Memory Modules DDR4-2400, 16GB, 2Gx72, R-DIMM 288P, 1.2V, Rank:2, CL17, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8)

Ethernet Modules BaseT CardCOM Express Type7 10GBASE-KR to 10GBASE-T adapter card

Ethernet Modules BaseT CardCOM Express Type7 10GBASE-KR to 10GBASE-T adapter card

DC Power Cords Wire:UL1185, 18AWG, L=300+/-20mm;P1/P2:ET1.0-8(Red)(Cord-end Terminal), P3:DC Plug, oe5.5x2.5

DC Power Cords Wire:UL1185, 18AWG, L=300+/-20mm;P1/P2:ET1.0-8(Red)(Cord-end Terminal), P3:DC Plug, oe5.5x2.5

Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 4 GB LPDDR4 , 32 GB eMMC, -40 C to 85 C

Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 4 GB LPDDR4 , 32 GB eMMC, -40 C to 85 C

Multiprotocol Modules Wi-Fi 6E, Wave 2, 2x2, Bluetooth 5.2,non-Vpro. PCIe, USB, M.2 2230 Operating Temperature -40 85 MPN: AX210.NGWGII.NV

Multiprotocol Modules Wi-Fi 6E, Wave 2, 2x2, Bluetooth 5.2,non-Vpro. PCIe, USB, M.2 2230 Operating Temperature -40 85 MPN: AX210.NGWGII.NV

Terminal Block Interface Modules 16CH OPTO-ISOLATED IN 8 RELAY

Embedded Box Computers ROScube-I, Intel Core i7-9850HE, RQI-57, DDR4 32G, 256GB SSD

Embedded Box Computers ROScube-I, Intel Core i7-9850HE, RQI-57, DDR4 32G, 256GB SSD

Computer-On-Modules - COM LEC-iMX64-2G-8G-ER SMARC Short Size Module with NXP i.MX6, Quad, 2 GB RAM, 8 GB eMMC, -40 C to +85 C

Computer-On-Modules - COM LEC-iMX64-2G-8G-ER SMARC Short Size Module with NXP i.MX6, Quad, 2 GB RAM, 8 GB eMMC, -40 C to +85 C

Memory Modules DDR4-3200, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8), anti-sulfur

Memory Modules DDR4-3200, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8), anti-sulfur

Single Board Computers 1-slot 4HP 3U CompactPCI blade Intel Xeon E-2276ML processor 32GB DDR4-2666 ECC

Single Board Computers 1-slot 4HP 3U CompactPCI blade Intel Xeon E-2276ML processor 32GB DDR4-2666 ECC

Memory Modules DDR5-5600, 32GB, 4Gx64, SO-DIMM 262P, 1.1V, CL46, Rank:2, Non-ECC, OP Temp:-40-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Memory Modules DDR5-5600, 32GB, 4Gx64, SO-DIMM 262P, 1.1V, CL46, Rank:2, Non-ECC, OP Temp:-40-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Buzzers & Audio Indicators - Board Mount Buzzer with wire,Rated Voltage=6V,Operating Voltage=4-8VSound Output=85dBA,Rated Frequency=2300+/-300Hz,Comsumption Current=40mA,Pitch=1.25mm,Wire length=150+/-10mm,F12x9mm

Buzzers & Audio Indicators - Board Mount Buzzer with wire,Rated Voltage=6V,Operating Voltage=4-8VSound Output=85dBA,Rated Frequency=2300+/-300Hz,Comsumption Current=40mA,Pitch=1.25mm,Wire length=150+/-10mm,F12x9mm

Development Boards & Kits - x86 COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

Development Boards & Kits - x86 COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

Embedded Box Computers Ampere Altra Q32-17 SOC, 2x 16GB DDR4 DRAM, 2x 128GB M.2 SSD, Tower Chassis with Liquid Cooling 120, 750-watt power supply

Embedded Box Computers Ampere Altra Q32-17 SOC, 2x 16GB DDR4 DRAM, 2x 128GB M.2 SSD, Tower Chassis with Liquid Cooling 120, 750-watt power supply

Memory Cards microSD, SDXC/SDHC, 32GB, C10/UHS-I U1, 100R/70W, 2.7-3.6V, Endurance:3K P/E, MLC, 11x15x1mm, OP Temp:-25-85

Memory Cards microSD, SDXC/SDHC, 32GB, C10/UHS-I U1, 100R/70W, 2.7-3.6V, Endurance:3K P/E, MLC, 11x15x1mm, OP Temp:-25-85

Computer-On-Modules - COM EGX-MXM-A4500-8GB-80W/Adlink logo

Memory Modules SDRAM PC133, 512MB, 32Mx16, SO-DIMM 144P, 3.3V, Rank:1, CL3, Non-ECC, OP Temp:0 70, Fix Die:Yes(J-die), PROMOS chip(32Mx16)

Memory Modules SDRAM PC133, 512MB, 32Mx16, SO-DIMM 144P, 3.3V, Rank:1, CL3, Non-ECC, OP Temp:0 70, Fix Die:Yes(J-die), PROMOS chip(32Mx16)

Memory Cards microSD, SDXC/SDHC, 32GB, UHS-I U1/V10/A1, 100R/70W, 2.7-3.6V, Endurance:80 TB, 3D TLC, 11x15x0.8mm, OP Temp:-25 85, with plastic case

Memory Cards microSD, SDXC/SDHC, 32GB, UHS-I U1/V10/A1, 100R/70W, 2.7-3.6V, Endurance:80 TB, 3D TLC, 11x15x0.8mm, OP Temp:-25 85, with plastic case

Single Board Computers 4HP cPCI-6540 with Intel Core i7-9850HL and 32GBDDR4-2666 soldered memory with 2x GbE, 2x USB 3.0, 1x RJ-45 COM and single PMC/XMC site with conformal coating

Single Board Computers 4HP cPCI-6540 with Intel Core i7-9850HL and 32GBDDR4-2666 soldered memory with 2x GbE, 2x USB 3.0, 1x RJ-45 COM and single PMC/XMC site with conformal coating

Interface Modules LPCIe-3488AIEEE488.2 Low Profile PCIe-bus